基本信息
制程工艺
台积电 4nm 制造工艺 八核CPU运行内存
LPDDR5 3200MHz 4x16位特点
支持5G双模(NSA+SA)双卡双通,支持毫米波CPU规格
1 x 2.91GHz Cortex-X2 & 1MB二级缓存 + 3 x 2.50GHz A710 & 3 x 512KB二级缓存 + 4 x 1.80GHz A510;6MB三级缓存,2MB系统缓存GPU规格
Adreno 725 @580MHz
性能
Geekbench 5单核
1225Geekbench 5多核
4050Geekbench 6单核
1690Geekbench 6多核
4550Aztec Runins Nomal帧率
99Aztec Runins High帧率
363DMark
2000安兔兔跑分
1000000
连接
蓝牙
Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 6900。Specification Version: Bluetooth® 5.3。Low Energy Features: Bluetooth® Low Energy Audio导航定位
QZSS, Galileo, Beidou, GLONASS, NavIC, GPSWIFI
Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 6900。Peak Speed: Up to 3.6 Gbps。Generation: Wi-Fi 4, Wi-Fi 5, Wi-Fi 6, Wi-Fi 6E。Standards: 802.11b, 802.11g, 802.11n, 802.11ac, 802.11a, 802.11ax。Spectral Bands: 6 GHz, 5 GHz, 2.4 GHz。Spatial Streams: Up to 4。Peak QAM: 4K QAM。Features: Dual-Band Simultaneous (DBS)1, OFDMA (UL/DL), MU-MIMO (UL/DL)